Calculate the height of solder balls after reflow
Author: noraraExecutions: 13976
※ This library was created by a member. This site is not responsible for its content.
The initial values for the land radius are displayed in increments of 0.5 starting from x=0, for a total of 10 values (up to 10 × 5 = 50).
If you enter a single value, such as 120, only the solution for that land radius will be displayed.
If you enter a single value, such as 120, only the solution for that land radius will be displayed.
No customer feedback for this calculation yet.
Required Information
・Radius [R] of the solder ball purchased from the material manufacturer
・Radius [r] of the pad (the circular area where the solder ball is placed)
The formulas for the volume of a sphere and the volume of a sphere with a portion removed are already known.
By solving these two formulas, we calculate the height of a given solder ball after reflow on a printed circuit board or semiconductor package pad.
The solution has a singular point at r = 0; in that case, R remains at its initial value.